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Xia Men Share Nano Technology Co, Ltd

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Electronic Component Cleaning Sponge

Clean stubborn stains only need clear water,Quickly remove residual flux

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Electronic Component Cleaning Sponge

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产品详情

Manufacturer supply electronic components cleaning sponge, resistance cleaning ,chip surface cleaning , Melamine Foam  Cleaning Spongecan be customized


Product description


electronic components cleaning sponge is a new type of cleaning products, pure physical decontamination, only water, no detergent, residual rosin, soldering iron and other oil stains on electronic components.

厦门思航电子元件清洁纳米海绵 电子元器件清洁绵 压缩密胺海绵.jpg电子元件清洁绵 厦门思航密胺海绵 去除电子元件上残余的助焊剂(松香)和各种污垢.jpg


Features


Meijiaxin electronic components cleaning sponge uses high-density nano-sponge. The ultra-fine fiber particles in the sponge are small and hard, suitable for grinding, and can quickly remove stubborn dirt on electronic components.

Microfiber: The material is fine, hard and super strong.

Strong descaling: magical cleaning power, no corrosive substances.


Applications


electronic component cleaning


Company advantage


The soldering iron cleaning sponge adopts a special processing technology to improve the physical properties of the melamine foam material, improve the pressing strength and reduce the material brittleness:

    High density and uniform texture;

 More wear-resistant, not easy to slag.

It compensates for the inherent defects of ordinary nano foam (density 8kg/m3) which are easy to crack, easy to slag and wear fast.


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产品详情

Manufacturer supply electronic components cleaning sponge, resistance cleaning ,chip surface cleaning , Melamine Foam  Cleaning Spongecan be customized


Product description


electronic components cleaning sponge is a new type of cleaning products, pure physical decontamination, only water, no detergent, residual rosin, soldering iron and other oil stains on electronic components.

厦门思航电子元件清洁纳米海绵 电子元器件清洁绵 压缩密胺海绵.jpg电子元件清洁绵 厦门思航密胺海绵 去除电子元件上残余的助焊剂(松香)和各种污垢.jpg


Features


Meijiaxin electronic components cleaning sponge uses high-density nano-sponge. The ultra-fine fiber particles in the sponge are small and hard, suitable for grinding, and can quickly remove stubborn dirt on electronic components.

Microfiber: The material is fine, hard and super strong.

Strong descaling: magical cleaning power, no corrosive substances.


Applications


electronic component cleaning


Company advantage


The soldering iron cleaning sponge adopts a special processing technology to improve the physical properties of the melamine foam material, improve the pressing strength and reduce the material brittleness:

    High density and uniform texture;

 More wear-resistant, not easy to slag.

It compensates for the inherent defects of ordinary nano foam (density 8kg/m3) which are easy to crack, easy to slag and wear fast.


Electronic Component Cleaning Sponge
Clean stubborn stains only need clear water,Quickly remove residual flux
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Electronic Component Cleaning Sponge

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Copyright: Xiamen Share Nano Technology Co.,  Ltd,  Fujian ICP No. 10200491.

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